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Polyimide Stripping

Plasma systems are effective for stripping polyimides and thick layers of photoresist, as well as descumming, etching, and removing organics. Typically, an oxygen plasma is used. Because oxygen is an active gas, ion bombardment as well as a chemical reaction occur. As a result, organic compounds and residues volatilize and are removed quickly.

Systems such as the YES-CV200 are ideally suited to removing polyimide in the shortest amount of production time.