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Wire Bond Surface Preparation
After hybrid manufacturers stick the IC chip to the ceramic substrate, it’s baked to cure the epoxy. But this process causes small amounts of contamination on top of the bond pads that can inhibit wire bonding. Therefore, treating the surface to remove contaminants improves the wire bond.
Additionally, plasma treating the surface increases the surface area of the bond pad. Because wire bonding is a gluing operation in which wire is affixed to the bond pad, an increase in the surface area of the bond pad significantly improves the wire bond pull strength (see adhesion promotion).
YES plasma cleaning systems such as the YES-G500 & YES-G1000 are ideally suited for wire bond surface preparation.
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