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Chemical Vapor Deposition System (with Plasma)
YES-1224P YES-1224P Specs
Process Management Software (option)
YES chemical vapor deposition (CVD) systems provide total environmental control over the deposition process and accommodate a variety of functionally diverse silanes, for a variety of processes, on a variety of surfaces.
YES-1224P gives process engineers control over:
- Amount of liquid
- Speed of liquid injection
- Vaporization chamber temperature
- Vapor line temperature
- Process vacuum chamber temperature
- Process starting pressure
- Exposure time
- Surface preparation
Common Applications
- Surface modification to prevent or promote adhesion
- Photoresist adhesion for semiconductor wafers
- Silane/substrate adhesion for microarrays (DNA, gene, protein, antibody, tissue)
- MEMS coating to reduce stiction
- BioMEMS and biosensor coating to reduce "drift" in device performance
- Promote biocompatibility between natural and synthetic materials
- Copper capping
- Anti-corrosive coating
The CVD Process
Complete dehydration followed by CVD coating provides a superior silane/substrate bond that is stable after exposure to atmospheric moisture, extending the time available between process steps. Chemical usage for a vapor deposition process is typically less than 1% of the amount needed for wet application processes, significantly reducing waste and chemical costs.
The CVD process begins with vacuum chamber cycle purges to dehydrate the product. The chamber is evacuated to low pressure and refilled with pure nitrogen several times to completely remove water vapor. Nitrogen is preheated, which helps heat the product.
Once cycle purges are finished, the YES-1224P system pumps the chemical directly from the source bottle to the heated vaporization chamber – without exposing the chemical to moisture.
YES-1224P accommodates two chemical source bottles as well as wide variations of vapor pressures among different silanes. Processes are easily programmed using a touch screen operator interface.
Adding Plasma Plasma cleaning prior to silane deposition improves repeatability. Plasma cleaning the process chamber before each run ensures all runs start from the same point. Additionally, plasma prepares the substrate for deposition.
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